BEGIN:VCALENDAR VERSION:2.0 PRODID:-//CERN//INDICO//EN BEGIN:VEVENT SUMMARY:Design and prototyping of large-scale flex circuits for the ATLAS ITk Pixel detector DTSTART;VALUE=DATE-TIME:20230906T160000Z DTEND;VALUE=DATE-TIME:20230906T162000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-3226@indico.tlabs.ac.za DESCRIPTION:Speakers: Steven Welch (CERN)\nThe tight space constraints of the ATLAS ITk Pixel system motivate the design of large-scale flex circuit s for carrying low-voltage power\, high-voltage sensor bias\, and command/ data transmission. These circuits extend over long distances in the barrel or large areas in the endcap rings\, and they pose unique design challeng es. We report on the design and prototyping of large-scale flex circuits f or the ATLAS ITk Pixel system\, with a focus on technical issues encounter ed and lessons learned.\n\nhttps://indico.tlabs.ac.za/event/112/contributi ons/3226/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/3226/ END:VEVENT BEGIN:VEVENT SUMMARY:Loading of ATLAS ITk pixel module on multi flavour local supports DTSTART;VALUE=DATE-TIME:20230906T154000Z DTEND;VALUE=DATE-TIME:20230906T160000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-3222@indico.tlabs.ac.za DESCRIPTION:Speakers: Gabriele Chiodini (CERN)\nFor the HL-LHC upgrade the current ATLAS Inner Detector is replaced by an all-silicon system. The pi xel detector will consist of three different subsystems with different mec hanical support structures\, resulting in an actively instrumented area of about 13m$^2$. The Outer Barrel is made of longerons and inclined half-ri ngs\, the Outer Endcaps is made of half-rings and the Inner System consist s of staves and rings. Prototypes of all flavours of support structures we re loaded with pixel modules based on the RD53A readout chip. The differen t loading techniques\, used in the different loading sites for the differe nt support structures\, are illustrated and discussed. The techniques rang e from being based on high precision positioned jig tools to multi-functio nal pick-and-place head on a robotic gantry.\nAfter the successful loading \, the performance of these first large scale detector prototype structure have been carefully evaluated ensuring also the electrical functionality of the modules after the loading process in a larger system.\nThe overview gives emphasis on the loading techniques of the pixel modules on the loca l support as well as their subsequent performance qualification.\n\nhttps: //indico.tlabs.ac.za/event/112/contributions/3222/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/3222/ END:VEVENT BEGIN:VEVENT SUMMARY:Module development for the ATLAS ITk Pixel Detector DTSTART;VALUE=DATE-TIME:20230906T144000Z DTEND;VALUE=DATE-TIME:20230906T150000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-3234@indico.tlabs.ac.za DESCRIPTION:Speakers: Matthias Saimpert (CEA Saclay IRFU/DPhP)\nAbstract:\ nIn HL-LHC operation the instantaneous luminosity will reach unprecedented values\, resulting in about 200 proton-proton interactions in a typical b unch crossing. The current ATLAS Inner Detector will be replaced by an all -silicon system\, the Inner Tracker (ITk). The innermost part of ITk will consist of a state-of-the-art pixel detector. \nSeveral different silicon sensor technologies will be employed in the five barrel and endcap layers. \nBased on first modules assembled using the RD53A prototype readout chip\ , numerous issues are studied\, and solutions found. These included produc tion issues like bump bonding of large area\, thin modules\, as well as la yout issues like optimization of the bandwidth and sharing of links betwee n multiple chips and modules. The talk will present results of many of the se studies\, which directly impacted the construction and assembly of pre- production modules using the first production version of the readout chip ITkPixV1. The status of the ITk preproduction pixel module will be present ed.\nSummary:\nIn this work the latest results with the latest pre-product ion ITkpix pixel module will be presented. In the ITk pixel system there a re 5 pixel layers and there will be different module flavours depending on their distance with respect to the interaction point:\n• In L2-4 there will be quad modules with 150 um thick planar sensors.\n• In L1 there wi ll be quad modules with 100 um thick planar sensors.\n• In L0 (the inner most layer) three different flavours of triplet modules will be used with different pixel sizes and hybrid shapes all on 150 um active thick substra tes but:\no 50 x50 um2 pixel size in the endcaps (rings)\no 25 x 100 um2 p ixel sizes in the barrel (staves)\nThe reasons for the election of the dif ferent technologies will be justified. The different assembly procedures a nd challenges found on the module prototyping phase will be described.\nAb out 15\,000-pixel modules will be built for the Inner Tracker. The module assembly requires very high precision and custom designed tooling that can provide extreme accuracy. Design aspects of the components and tooling wi ll be discussed.\nThe module deign is validated for bump delamination caus ed by thermal stress due to the wide operational temperature range of -45 and +40°C. Results from the design validation will be presented.\nAll the modules have to undergo an exhaustive quality control protocol based on m etrology and electrical functionality. These tests ensure that the whole d etector will fit without problems within the tight ATLAS volume available\ , perform electrically within a serial power chain within the tight poweri ng envelope and with the required pixel analogue and digital performance. \nFinal QC test of each module will include a thermal cycling in a wide ra nge of temperatures between -45 and +40°C in order to estimate reliabilit y of the modules. All electrical parts of the pixel modules need to be car efully tested and the modules which did not meet the required specificatio ns will be rejected during production. A description of the QC procedure a nd the most recent test results will be presented\, including the results of basic and advanced pixel module tests.\n\nhttps://indico.tlabs.ac.za/ev ent/112/contributions/3234/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/3234/ END:VEVENT BEGIN:VEVENT SUMMARY:ALICE Inner Tracking System upgrade: characterization of first chi ps fabricated in 65 nm CMOS technology DTSTART;VALUE=DATE-TIME:20230906T150000Z DTEND;VALUE=DATE-TIME:20230906T152000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-2811@indico.tlabs.ac.za DESCRIPTION:Speakers: Antonio Trifirò (Università di Messina & INFN sez. di Catania)\nThe Inner Tracking System of ALICE (A Large Ion Collider Exp eriment) will undergo a major upgrade during the next Long Shutdown of LHC aimed at enhancing the tracking capability. In particular\, the three inn ermost sectors of the current vertex tracker will be replaced by truly cyl indrical layers produced by using curved (wafer-scale) silicon sensors thi nner than 50 µm\, based on monolithic active pixel structures realised in a 65 nm CMOS process. The innermost layer will be placed at only 18 mm of radial distance from the interaction point guaranteeing at the same time a material budget as low as 0.05% of a radiation length X0.\n\nThe R&D on the sensor ASICs involves a series of submissions in silicon and the first one (named MLR1: Multi-Layer per Reticle 1) was completed at the end of 2 020. MLR1 provided several test structures containing transistors\, memori es and small matrices of pixels with integration of front-end electronics inside the sensitive area of the pixels\; these devices have been used to qualify the technology in terms of performance and radiation hardness. In particular\, to evaluate the charged particle detection performance\, this first submission includes 3 variants of pixel matrices: analog pixel test structure (APTS\, 4x4 pixels of 10\, 15\, 20 and 25 µm pitch\, with anal og readout)\; digital pixel test structure (DPTS\, 32x32 pixels of 15 µm pitch\, with digital in-pixel discrimination and digital readout)\; CE65 ( 64x32 pixels of 15 µm pitch\, test structures with rolling shutter analog readout).\n\nThis contribution will provide an overview of these test str uctures\, describing the results of characterisations performed with radio active sources and beam tests in order to choose the best pixel pitch and sensor configuration\, optimising timing\, charge collection efficiency an d stability after radiation damage. The obtained results show a satisfacto ry behaviour as 100% efficiency for charged particles in the range of GeVs and timing of few ns\, giving the direction for the next submission (ER1: Engineering Run 1) directed to large\, stitched sensor chips.\n\nhttps:// indico.tlabs.ac.za/event/112/contributions/2811/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/2811/ END:VEVENT BEGIN:VEVENT SUMMARY:System tests of the ATLAS ITk planar and 3D pixel modules DTSTART;VALUE=DATE-TIME:20230906T140000Z DTEND;VALUE=DATE-TIME:20230906T142000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-3088@indico.tlabs.ac.za DESCRIPTION:Speakers: David Vazquez ()\nA new all-silicon Inner Tracker (I Tk) has been designed for the ATLAS experiment at the HL-LHC. As part of this\, a new pixel detector consisting of a total area of approximately 1 2m2\, will be constructed with planar and 3D pixel modules\, mounted onto ring and stave shaped low mass carbon-fibre fibre support structures. The data will be transmitted optically to the off-detector readout system. To save material in the servicing cables\, serial powering is employed for t he supply voltage of the readout ASICs. Together\, these structures are ar ranged on larger structures to provide tracking up to a pseudo rapidity of 4.0. In order to validate the design of this new tracker\, large scale p rototyping programmes are being carried out by all subsystems. A series of system tests has been performed\, with some of these prototypes\, to asse ss the performance of modules arranged into serial power chains mounted on to realistic mechanical structures. In this report\, the prototype load ed local supports and test infrastructure is described. The key results o f the tests are presented\n\nhttps://indico.tlabs.ac.za/event/112/contribu tions/3088/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/3088/ END:VEVENT BEGIN:VEVENT SUMMARY:Integration Tests with 2S Module Prototypes for the Phase-2 Upgrad e of the CMS Outer Tracker DTSTART;VALUE=DATE-TIME:20230906T142000Z DTEND;VALUE=DATE-TIME:20230906T144000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-2798@indico.tlabs.ac.za DESCRIPTION:Speakers: Lea Stockmeier ()\nThe CMS experiment will be upgrad ed until 2028 to deal with the increased luminosity of the HL-LHC. During this Phase-2 Upgrade\, the CMS Outer Tracker will be equipped with modules each assembled with two silicon sensors. These are placed on mechanical s tructures in form of ladders in the central barrel of the Outer Tracker or disks in the endcap region.\n\nDuring the prototyping phase the modules a re initially investigated individually to evaluate their performance. Next steps are integration tests performed with the purpose to test the module functionality on the final detector structures. Investigations focus on t he cooling performance as well as on electrical performance of a group of modules on the supporting structures.\n\nThis contribution summarizes inte gration tests with the Outer Tracker module prototypes. The main focus wil l be on a cooled ladder integration test performed at CERN and a full ladd er integration test at Institut Pluridisciplinaire Hubert Curien (Strasbou rg).\n\nhttps://indico.tlabs.ac.za/event/112/contributions/2798/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/2798/ END:VEVENT BEGIN:VEVENT SUMMARY:The ATLAS ITk Strip End-of-Substructure Card - From design to prod uction DTSTART;VALUE=DATE-TIME:20230906T152000Z DTEND;VALUE=DATE-TIME:20230906T154000Z DTSTAMP;VALUE=DATE-TIME:20260614T232038Z UID:indico-contribution-523-2980@indico.tlabs.ac.za DESCRIPTION:Speakers: Marcel Stanitzki (DESY)\nThe building blocks of the ATLAS Strip Tracker for HL-LHC are modules that host silicon sensors and f ront-end electronics. The modules are mounted on carbon-fiber substructure s hosting up to 14 modules per side. An End-of-Substructure (EoS) card on each substructure side connects up to 28 differential data lines at 640 Mb it/s to lpGBT and VL+ ASICs that provide data serialization and 10 GBit/s optical data transmission to the off-detector systems respectively. A dedi cated\, magnetic-field resistant DC-DC converter provides both 1.2 and 2.5 V to the EoS using the rad-hard bPol ASICS from CERN. Overall almost 200 0 EoS card need to be manufactured.\nThe EoS card recently went into produ ction and we report on our first experience during production and integrat ion. Additionally we report results from recent quality assurance tests as well as lessons learned throughout the project from design to production. \n\nhttps://indico.tlabs.ac.za/event/112/contributions/2980/ LOCATION: Auditorium 2 URL:https://indico.tlabs.ac.za/event/112/contributions/2980/ END:VEVENT END:VCALENDAR